发明名称 CHUCK FOR SUPPORTING SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
摘要 PURPOSE: A chuck for supporting a semiconductor substrate and a method for manufacturing the same are provided to be capable of effectively controlling the temperature of the semiconductor substrate. CONSTITUTION: A chuck(200) for supporting a semiconductor substrate(10) is provided with a ceramic plate(210) for loading the semiconductor substrate and a body part(202) for loading the ceramic plate. At this time, a plurality of first gas flow paths are formed at the inner portion of the ceramic plate for supplying gas in order to control the temperature of the semiconductor substrate and a plurality of gas flow holes are connected through the first gas flow paths. Preferably, the ceramic plate includes the first ceramic plate and the second ceramic plate connected with one surface of the first ceramic plate.
申请公布号 KR20030094492(A) 申请公布日期 2003.12.12
申请号 KR20020031449 申请日期 2002.06.04
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, TAE WON;PARK, JAE YEONG;PARK, YU CHUN;SUNG, SUN HWAN
分类号 H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/68
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