| 摘要 |
<p>A surface treatment copper foil that can satisfactorily ensure an adhesive strength with a low dielectric substrate for use in the constructing of a printed wiring board for high-frequency use and that can minimize transmission loss. In particular, a surface treatment copper foil for low dielectric substrate, used in a form adhering to a low dielectric substrate, which surface treatment copper foil on its surface is provided with a roughened layer composed of nodular copper grains, the roughened layer on its entire surface having superfine copper grains deposited and stuck thereto. The roughened layer exhibits a surface roughness (Rz) of 1.0 to 6.5 μm, and with respect to the color of the surface of the surface treatment copper foil, L* is 50 or below, a* 20 or below and b* 15 or below. The surface of deposited and stuck superfine copper grains on the entire surface of nodular copper grains of the roughened layer is provided with a rust-proofing layer comprising at least one of zinc and nickel.</p> |
