| 摘要 |
A method is provided for manufacturing a semiconductor device that can reduce the number of steps in manufacturing a triple-well that includes multiple ion implantation steps and heat treatment steps. The method comprises the steps of: (a) forming a first mask layer having a first opening section on a semiconductor substrate; (b) forming a first dielectric layer on an exposed surface of the semiconductor substrate in the first opening section; (c) forming an impurity layer by introducing a first impurity of a second conductivity type in the semiconductor substrate through the first dielectric layer; (d) conducting a heat treatment to form a first well, and a second dielectric layer on the exposed surface of the semiconductor substrate in the first opening section; (e) forming a second mask layer having a second opening section on the first mask layer; and (f) forming a second well within the first well by introducing a second impurity of the first conductivity type in the semiconductor substrate through the second dielectric layer.
|
