| 摘要 |
A polishing apparatus includes a polishing pad (2) rotated by a surface place rotating shaft (3), a slurry conduit (4) supplying slurry to an upper surface of the polishing pad, a substrate holding mechanism (6) holding a substrate, a substrate rotating shaft (8) rotating the substrate holding mechanism about a substrate axis (B) and a rotating mechanism (9) rotating the substrate axis about an eccentric axis (C). Angular velocity of rotation of the substrate axis about the eccentric axis is set larger than angular velocity of rotation of the substrate holding mechanism about the substrate axis. Thus, contact area between a small area on the substrate and the polishing pad is increased, bias wear of abrasive grains on the polishing pad is prevented, clogging of the polishing pad is suppressed, and new abrasive grains and new chemicals can be supplied with high efficiency to each area of the substrate. Thus, polishing rate is improved. <IMAGE> |
