发明名称 Thin film semiconductor device and method for producing the same
摘要 In order to fabricate a high performance thin film semiconductor device using a temperature process in which it is possible to use inexpensive glass substrates, a highly crystalline mixed-crystallinity semiconductor film is deposited by means of PECVD using a silane as the source gas and argon as the dilution gas, then the crystallinity of this film is improved by such means as laser irradiation. Thin film semiconductor devices fabricated in this way are used in the manufacture of such things as liquid crystal displays and electronic devices. In applying the present invention to the fabrication of an active matrix liquid crystal display, it is possible to both easily and reliably fabricate a large, high-quality liquid crystal display. Additionally, in applying the present invention to the fabrication of other electronic circuits as well, it is possible to both easily and reliably fabricate high-quality electronic circuits.
申请公布号 US6660572(B2) 申请公布日期 2003.12.09
申请号 US20020084481 申请日期 2002.02.28
申请人 SEIKO EPSON CORPORATION 发明人 MIYASAKA MITSUTOSHI
分类号 C23C16/02;C23C16/24;G02F1/1362;H01L21/20;H01L21/205;H01L21/285;H01L21/336;H01L29/786;(IPC1-7):H01L21/31 主分类号 C23C16/02
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