| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which a conductive material can be easily provided in a through hole, and to provide its manufacturing method, a circuit board and electronic equipment. SOLUTION: A semiconductor chip 10 is fixed on a fixing jig 20, one end of the semiconductor chip 10 is elevated at a predetermined angleθ(refer to (a)). A number of solder balls 40 are discharged from a higher position (right end). The solder balls 40 roll on a first plane 30, and some of them are trapped in through-holes 14. Air is sucked from a second plane side 32 to an arrow- marked direction 42. The solder balls 40 which are not trapped in the through- holes 14 pass toward the lower position (left end) of the first plane 30. The fixing jig 20 is further elevated and finally elevated by 2θin total (refer to (b)). Thereby, the solder balls 40, which are not trapped in the through-holes 14 and remained on the first plane 30, pass toward the lower position (left end) of the first plane 30, too. After the unnecessary solder balls 40 are removed, one-side ends (right end) of the semiconductor chip 10 and the fixing jig 20 are descended and returned to a horizontal state. COPYRIGHT: (C)2004,JPO
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