| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wire bonding device and a wire bonding method which can surely pressure-bond a wire to a bonding surface. <P>SOLUTION: An angle between bonding surfaces 31, 32 and a reference surface 39 is measured by an inclination measuring means 44 and a capillary 33 is displaced by an inclination adjusting means 28 based on a measurement result. Thereby, it is possible to adjust the central axial line L1 of the capillary 33 to be vertical relative to the bonding surfaces 31, 32. Since the pressure bonding surface 40 of the capillary 33 is thereby prevented from coming into biased contact with a conductive wire 23, and the conductive wire 23 can surely be subjected to pressure-bonding to the bonding surfaces 31, 32. Accordingly, it is possible to improve bonding strength and to prevent a bonding defect. Continuous and sure wire pressure bonding can be carried out by adjusting the angle between the capillary 33 and the bonding surfaces 31, 32 for each bonding surface. <P>COPYRIGHT: (C)2004,JPO |
