发明名称 |
Process for encapsulating a component made of organic semiconductors |
摘要 |
A process for encapsulating a component made of organic semiconductors is provided which includes steps of: a) providing a housing including a substrate with electrical connections and a cover; b) mixing a soldering glass with at least one of a binder and a solvent; c) applying the soldering glass at least to the cover, in the form of an encircling bank; d) expelling the binder or solvent; e) sintering-on of the solder; f) covering the substrate with layers which represent the semiconductor component together with electrodes; g) placing the cover onto the substrate; and h) locally heating the soldering glass by means of a light source with a predetermined peak wavelength, wherein the housing parts and soldering glass are matched to one another such that their coefficients of thermal expansion differ from one another by less than 1.0x10<-6>K<-1>. |
申请公布号 |
US2003222061(A1) |
申请公布日期 |
2003.12.04 |
申请号 |
US20030429057 |
申请日期 |
2003.05.02 |
申请人 |
PATENT-TREUHAND-GESELLSCHAFT FUR ELEKTRISCHE GLUEHLAMPEN MBH |
发明人 |
LANGER ALFRED;MESSNER EKKEHARD |
分类号 |
H05B33/10;H01L51/50;H01L51/52;H05B33/04;(IPC1-7):B23K26/00 |
主分类号 |
H05B33/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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