发明名称 |
Method of electroplating copper over a patterned dielectric layer |
摘要 |
In a new method of electroplating metal onto a patterned dielectric layer including small diameter vias and large diameter trenches, a pulse reverse electroplating sequence with a two-component chemistry is modified to substantially fill the vias, while in a subsequent DC deposition the bulk material is deposited to completely fill the large diameter trenches. Thus, good control quality compared to conventional three-component chemistry electroplating is obtained while the superior characteristics of a metal layer deposited by a two-component chemistry are preserved. The method is particularly advantageous in electroplating copper.
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申请公布号 |
US2003221966(A1) |
申请公布日期 |
2003.12.04 |
申请号 |
US20020284953 |
申请日期 |
2002.10.31 |
申请人 |
BONKASS MATTHIAS;PREUSSE AXEL;NOPPER MARKUS |
发明人 |
BONKASS MATTHIAS;PREUSSE AXEL;NOPPER MARKUS |
分类号 |
C25D3/38;C25D5/18;C25D7/12;H05K3/42;(IPC1-7):C25D5/02;C25D7/00 |
主分类号 |
C25D3/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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