| 摘要 |
PURPOSE: A temperature sensing structure of dry etching equipment is provided to be capable of reliably controlling the temperature of a wafer chuck by using two temperature sensors. CONSTITUTION: A temperature sensing structure of a dry etching equipment is provided with a reaction chamber for supplying a vacuum state reaction space, a wafer chuck(130) installed at the inner portion of the reaction chamber for stably fixing a wafer(W), and the first and second temperature sensor(150,152) for sensing the temperature of the wafer chuck. At this time, the wafer chuck is used as a lower electrode. Preferably, the first temperature sensor is connected with a main system(190). Preferably, the second temperature sensor is connected with an alarm part(192), wherein the alarm part is located at the outside.
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