METHOD FOR PEELING DEPOSITED FILM ON SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a method for easily peeling a deposited film formed on a substrate without causing changes in the flatness of the surface of the film at deposition and the quality of the film. SOLUTION: In the method for peeling the deposited film 33 formed on the substrate 23, the deposited film 33 is formed on the substrate 23 across a carbon thin film 34. It is desirable that the carbon thin film 34 is deposited to≥2 nm film thickness by a vacuum deposition method or sputtering method where the minimum angle of incidence of sputtered particles upon the substrate is≤40°. The deposited film 33 can be easily peeled off from the substrate 23 by the use of water or water incorporated with a surfactant. COPYRIGHT: (C)2004,JPO