LAMINATED FILM FOR PHOTORESIST

摘要

PROBLEM TO BE SOLVED: To provide an excellent laminated film for a photoresist capable of producing high-definition printed circuit boards in a good yield and contributing toward enhancing resolution and lowering rejection rate when used as a film for a photoresist.

SOLUTION: The laminated film for a photoresist is obtained by laminating a photosensitive layer (C) on one face of a multilayer polyester film formed by laminating a polyester film (B) on at least one face of a polyester film (A) and further laminating a protective film (D) on the surface of the layer (C), wherein the number X of coarse foreign particles of ≥20 μm present in the multilayer polyester film is in the range of 0≤X≤10 (/m2) and the polyester film (B) contains 0.01-0.1 wt.% particles (I) of 0.8-2.5 μm average particle diameter and 0.1-0.8 wt.% particles (II) of 0.01-0.2 μm average particle diameter.

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