发明名称 PEELING LIQUID FOR NICKEL OR NICKEL ALLOY
摘要 PROBLEM TO BE SOLVED: To provide a peeling liquid for selectively peeling a nickel or nickel alloy film at a high speed without peeling films consisting of metals other than nickel or nickel alloys, particularly, copper and copper alloy films and tin and tin alloy films. SOLUTION: The peeling liquid for nickel or nickel alloys comprises an aqueous solution containing (a) hydrogen peroxide, (b) an inorganic acid, (c) a quaternary ammonium salt and (d) a 3 to 7C aliphatic alcohol. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003342756(A) 申请公布日期 2003.12.03
申请号 JP20020157954 申请日期 2002.05.30
申请人 MITSUBISHI GAS CHEM CO INC 发明人 TAKAHASHI KENICHI;KOGURE NAOKI;HOSODA ATSUSHI
分类号 C23F1/00;C23F1/16;C23F1/28;C23F1/44;H05K3/06;(IPC1-7):C23F1/00 主分类号 C23F1/00
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