发明名称 ETCHING EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PURPOSE: An etching equipment for manufacturing a semiconductor device is provided to be capable of detecting whether an upper electrode plate assembly is located at a predetermined falling position, or not, for normally carrying out a stable process. CONSTITUTION: An etching equipment is provided with a lower body part(12) having a lower electrode plate assembly, an upper body part(14) loaded and fixed to the upper portion of the lower body part, an upper electrode plate assembly(16) having a support plate(18), installed at the upper portion of the upper body part, a plurality of support shaft parts(20) for supporting the interval between the upper body part and the support plate, and a motor(28) connected to each support shaft part through a plurality of chains(26a,26b) for controlling the position of the upper electrode plate assembly. Preferably, the etching equipment further includes a plurality of position detectors(34a,34b) for checking whether the upper electrode plate assembly is located at a predetermined position, or not.
申请公布号 KR20030091430(A) 申请公布日期 2003.12.03
申请号 KR20020029463 申请日期 2002.05.28
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JU, YEONG SU
分类号 H01L21/3065;(IPC1-7):H01L21/306 主分类号 H01L21/3065
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