| 摘要 |
PROBLEM TO BE SOLVED: To provide a reflow furnace, in which heating temperature in a main heating zone is rapidly cooled after heating to reduce adverse influence on electronic components, solving the problem that lead-free solder that has been employed of late due to a restriction trend in the use of lead has a high melting point and resultantly the heating temperature in the main heating zone is inevitably increased. SOLUTION: A cooling pipe is arranged at either a blowout hole or a suction hole, or at both of them to allow low temperature water or outer air flowing into the cooling pipe from an outer flowing device to improve cooling effect. COPYRIGHT: (C)2004,JPO
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