发明名称 |
Semiconductor device having chip scale package |
摘要 |
A first surface of a semiconductor chip and an upper surface of a circuit board are bonded with a pad of the semiconductor chip fitted to a first opening of the circuit board. The pad is electrically connected to a wire of the circuit board. The pad is sealed with a first resin. A second resin is disposed on the upper surface of the circuit board. A second resin includes an upper surface at a height substantially equal to a height of a second surface of the semiconductor chip at a point apart from a corner of a square of the first surface of the semiconductor chip.
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申请公布号 |
US6656766(B2) |
申请公布日期 |
2003.12.02 |
申请号 |
US20030338538 |
申请日期 |
2003.01.07 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
NOSHITA KAZUYUKI |
分类号 |
H01L23/29;H01L21/60;H01L23/00;H01L23/12;H01L23/31;(IPC1-7):H01L21/44 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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