| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element having bumps and a semiconductor device capable of reducing switching noise, noise in a signal line, and crosstalk generated between wires. SOLUTION: A semiconductor element 300 with bumps, where at least one resistor bump 22 and at least one dielectric bump 23 other than regular bumps 21 are formed on an electrode of the semiconductor element 10, is mounted on a printed wiring board 40, and thus obtaining the semiconductor device 400 where the bumps 21, the resistor bump 22 and the dielectric bump 23 of the semiconductor element with bumps are electrically connected to a wiring layer 49. |
