发明名称 VAPOR DEPOSITION METHOD OF LOW DIELECTRIC INSULATING FILM, THIN FILM TRANSISTOR USING THE SAME AND PREPARATION METHOD THEREOF
摘要 The present invention relates to a process for vapor depositing a low dielectric insulating film, a thin film transistor using the same, and a preparation method thereof, and more particularly to a process for vapor deposition of low dielectric insulating film that can significantly improve a vapor deposition speed while maintaining properties of the low dielectric insulating film, thereby solving parasitic capacitance problems to realize a high aperture ratio structure, and can reduce a process time by using silane gas when vapor depositing an insulating film by a CVD or PECVD method to form a protection film for a semiconductor device. The present invention also relates to a thin film transistor using the process and preparation method thereof.
申请公布号 AU2003269049(A1) 申请公布日期 2003.12.02
申请号 AU20030269049 申请日期 2003.01.15
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SUNG-HOON YANG;WAN-SHICK HONG;KWAN-WOOK JUNG
分类号 G02F1/1368;C23C16/30;C23C16/42;G02F1/1362;H01L21/205;H01L21/312;H01L21/77;H01L21/84;H01L27/12;H01L27/32;H01L29/786;H01L51/56;(IPC1-7):C23C16/00;H01L21/44 主分类号 G02F1/1368
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