| 摘要 |
PROBLEM TO BE SOLVED: To provide a compact, reliable and efficient cooling unit for semiconductor chips. SOLUTION: A plurality of semiconductor chips have their active surfaces mounted to a major substrate which provides electrical connections among the chips, and cooling channels are formed above the major substrate and respective chips for conducting a cooling fluid over back surfaces of the chips. To increase cooling efficiency, heat sink arrays are formed on the back surfaces of the chips, and each array includes a plurality of heat conducting elements attached to the back surface. The arrays can be readily and inexpensively constructed by photolithography or wire bonding techniques. To control the flow of the cooling fluid around edges of the chips and to prevent the cavitation of the cooling fluid, a cavitation and flow control plate disposed at the bottom of the cooling channel and formed around the edges of the chips is included. With the increased cooling efficiency, the height of each cooling channel can be substantially reduced to allow the close stacking of interconnection substrates for three-dimensional packages and to shorten a vertical communication time between the interconnect substrates. COPYRIGHT: (C)2004,JPO |
