| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology for surely connecting a plug and wiring in a process for forming a connecting hole reaching an interlayer dielectric film formed on the upper layer of the wiring having Al as a principal component, and forming a plug in the connecting hole. SOLUTION: When the deposition temperature of an Al alloy film 19 which becomes a principal conductive layer of wiring 21 is taken as A, a temperature in a heat treatment process (degassing process) after forming a connecting hole 23 in an interlayer dielectric film 22 is taken as B, and the deposition temperature of a TiN film 25 which becomes a barrier conductive film 26 in the connecting hole 23 is taken as C, relations A≥B≥C, and A>C are simultaneously satisfied. COPYRIGHT: (C)2004,JPO
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