ADHESIVE AGENT COMPOSITION FOR SEMICONDUCTOR DEVICE, ADHESIVE AGENT SHEET FOR SEMICONDUCTOR DEVICE USING THE COMPOSITION, SUBSTRATE FOR SEMICONDUCTOR CONNECTION, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To industrially provide a new adhesive agent composition for a semi conductor device wherein superior adhesion and thermal resistance can be simul taneously achieved while superior transparency and a discriminating property are held, an adhesive agent sheet for a semiconductor device which uses the composition and a semiconductor device, and to improve the reliability and productivity of a semiconductor device. SOLUTION: The adhesive agent composition for a semiconductor device characterized by that the transmittance of a parallel ray is at least 5% and a haze value is 10-80%, the adhesive agent sheet for a semiconductor device which uses the composition, a substrate for semiconductor connection and the semiconductor device are obtained. COPYRIGHT: (C)2004,JPO