发明名称 LC-elementti, puolijohdelaite ja LC-elementin valmistusmenetelmä
摘要 An LC element and an semiconductor device comprising a second electrode (26) having a predetermined shape formed in direct contact with the surface of a semiconductor substrate (30), and a first electrode (10) having a predetermined shape formed interspaced by an insulation layer (28) on the semiconductor substrate surface; and a method of manufacturing the LC element. A channel (22) formed along the first electrode (10) on application of a predetermined gate voltage to a control electrode connected to the first electrode (10) and the second electrode (26) respectively function as inductors, while a distributed constant type capacitor is also formed between these; and by using the channel (22) as a signal transmission line, the LC element and a semiconductor device give excellent attenuation characteristics. The LC element and semiconductor device are easily manufactured, while parts assembly work in subsequent processing can be abbreviated, formation as a portion of an IC or LSI device is possible, and characteristics can also be controlled. <IMAGE>
申请公布号 FI112406(B) 申请公布日期 2003.11.28
申请号 FI19940005242 申请日期 1994.11.08
申请人 IKEDA,TAKESHI;OKAMURA,SUSUMU 发明人 IKEDA,TAKESHI;OKAMURA,SUSUMU
分类号 H01L27/08;H03H7/01;(IPC1-7):H01L27/08;H01L27/04;H01L21/822 主分类号 H01L27/08
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