ELECTRONIC COMPONENT HEAT SINK, ITS MANUFACTURING DEVICE AND METHOD

摘要

FIELD: electronic engineering; heat sinks for electronic components. SUBSTANCE: heat sink designed for cooling heat-releasing sources such as electronic components has plurality of heat-SINK plates joined together so as to form heat- absorbing part coming in contact with heat-transfer surface of electronic component; some of heat-- transfer plates opposing mentioned heat-absorbing part are separated from each other and together they form heat-transfer part and fastening means for joining plurality of heat-sink plates together. Heat sink incorporates plurality of spacers to provide clearance between heat-transfer parts of plates; each of these spacers is disposed between jointing parts of adjacent heat-sink plates or the latter are spaced apart due to pre-bending them through predetermined angles. Heat-sink plates are formed by plurality of ribs spaced apart through preset interval. Preferred fastening is by means of riveting. During manufacture of heat-sink plates ridges are formed on some of them so that heat-transfer part of heat sink is bent out by means of ridge through predetermined angle. Proposed design of heat sink makes it possible to dispense with fan so that noiseless cooling of electronic component is ensured. Device and method for manufacturing such heat sink are proposed. EFFECT: reduced thermal resistance and power requirement. 18 cl, 17 dwg