| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board that is increased in adhesion between an insulating layer and a wiring pattern and reduced in transmission loss caused by a skin effect, and to provide a method of manufacturing the wiring board and a conductor-laminated board used for the wiring board and method. SOLUTION: The wiring board X1, provided with at least one insulating layer 11a and 11b and at least one wiring pattern 12a and 12b which are in contact with a insulating layers 11a and 11b, is provided with a plurality of anchor sections 14 which are composed of a metallic material which is different from that used in the wiring patterns 12a and 12b and separated from each other are provided on one or both surfaces of the patterns 12a and 12b which are in contact with the insulating layers 11a and 11b. In the conductor-laminated board provided with an insulating substrate and conductor foil laminated to one or both sides of the substrate, a plurality of anchor sections having a higher resistivity than the conductor foil has and separated from each other are provided on one or both surfaced of the conductor foil. COPYRIGHT: (C)2004,JPO |
