发明名称 SUBSTRATE SUCKING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate sucking apparatus for sucking a substrate such as a silicon wafer, a glass plate to a holder in which the substrate can be detached accurately without deteriorating quality of the holder and a connecting tube even when the sucking apparatus stops operating due to a power failure with the substrate sucked to the holder by means of vacuum suction. SOLUTION: The substrate sucking apparatus comprising the holder 1 formed with an intake vent 1d for sucking the substrate 17, a vacuum pump 13 for sucking the substrate 17, a connecting pipe 5 for connecting with the intake vent 1d provided in the holder 1 and a tube 11 for connecting the connecting pipe 5 and the vacuum pump 13, wherein the connecting pipe 5 is provided with a vacuum producing lever 9 for interchanging an interconnection between the intake vent 1d and the atmosphere and an interruption between both. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003332409(A) 申请公布日期 2003.11.21
申请号 JP20020134374 申请日期 2002.05.09
申请人 NIKON CORP 发明人 FUJITA YOSHIYUKI
分类号 B25J15/06;H01L21/68;H01L21/683;(IPC1-7):H01L21/68 主分类号 B25J15/06
代理机构 代理人
主权项
地址