| 摘要 |
PROBLEM TO BE SOLVED: To prevent warping of a semiconductor wafer and to realize fine working. SOLUTION: When a plurality of semiconductor elements 19 are formed in the semiconductor wafer, grooves for stress relief 11 are formed in scribing regions 10 between semiconductor element forming regions 9. The grooves 11 are formed in the scribing regions 10 except for alignment pattern forming regions 23 so that the alignment pattern forming regions 23 remain in the scribing regions 10. An alignment pattern and a TEG pattern, which are used in a photolithography process, are formed in the alignment pattern forming regions 23 of the scribing regions 10. COPYRIGHT: (C)2004,JPO |
