FLEXIBLE PRINTED WIRING BOARD FOR CHIP-ON-FILM

摘要

A flexible printed wiring board that has an insulating layer of high light transmission, is excellent in adhesive strength and migration resistance and is suitable for chip-on-film (referred to as COF). In particular, a flexible printed wiring board for COF having an insulating layer laminated with a conductive layer of electrolytic copper foil, the insulating layer after etching of the conductive layer so as to form a circuit exhibiting a light transmission of 50% or higher at etching area, wherein the electrolytic copper foil at its surface bonded to the insulating layer is provided with a rustproof layer of nickel/zinc alloy, the bonded surface exhibiting a surface roughness (Rz) of 0.05 to 1.5 mum and a specular glossiness of 250 or greater at an incident angle of 60º.