| 摘要 |
<p>A finishing machine using laser beam, comprising a cutting blade (202) and a laser beam processing means (164), the laser beam processing means (164) further comprising a laser beam transmitting means (68), a laser beam modulating means (70), and a laser beam radiating means (78), the laser beam modulating means (70) further comprising a laser beam pulse width setting means (74) for setting the pulse width of the laser beam transmitted by the laser beam transmitting means (68) to 1000 ps or narrower, wherein an insulator with a low dielectric constant stacked on a semiconductor wafer is cut by laser beam along a specified line, and then the semiconductor wafer is cut by the cutting blade.</p> |
