发明名称 A method and apparatus for interconnecting multiple devices on a circuit board
摘要 <p>A circuit board (500) has first and second devices (510, 530) preferably located on first and second opposing surfaces respectively. The first device has at least one region (512, 516) of a first type of pin node for a first type of signal and a region (514) with a second type of pin for a second type of signal. The second device includes at least one region (532, 536) having pins of the first type and region (534) having pins of the second type. The regions of the second types of pins of each device being separated by at least one of the regions of the first type of pin of one or both devices. Further devices may be arranged on the circuit board.</p>
申请公布号 GB2388714(A) 申请公布日期 2003.11.19
申请号 GB20030018246 申请日期 2000.05.25
申请人 * INTEL CORPORATION 发明人 MING * ZENG;SANJAY * DANRAL
分类号 H05K1/02;H05K1/18;(IPC1-7):H05K1/18 主分类号 H05K1/02
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