发明名称 |
HEAT INSULATING MATERIAL COMPOSITION |
摘要 |
PROBLEM TO BE SOLVED: To provide a new material which has the heat insulating property comparable to that of urethane foam and in which at least one of the defects of urethane foam is improved. SOLUTION: This heat insulating material composition contains cement, aggregate, a granular body of an expanded organic resin of≥4 parts weight and <40 parts weight on the basis of 100 parts weight cement and an organic binder (excluding a water-soluble macromolecule) of≥1 part weight and≤50 parts weight. The content of the granular body of the expanded organic resin exceeds 5 wt.% of this composition. COPYRIGHT: (C)2004,JPO |
申请公布号 |
JP2003327464(A) |
申请公布日期 |
2003.11.19 |
申请号 |
JP20020138188 |
申请日期 |
2002.05.14 |
申请人 |
OHBAYASHI CORP;SK KAKEN CO LTD |
发明人 |
HORI OSAO;TAKAHASHI KOICHIRO;KARUGA HIDETO |
分类号 |
C04B28/02;C04B16/08;C04B24/24;C04B111/40;(IPC1-7):C04B28/02 |
主分类号 |
C04B28/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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