发明名称 HEAT INSULATING MATERIAL COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a new material which has the heat insulating property comparable to that of urethane foam and in which at least one of the defects of urethane foam is improved. SOLUTION: This heat insulating material composition contains cement, aggregate, a granular body of an expanded organic resin of≥4 parts weight and <40 parts weight on the basis of 100 parts weight cement and an organic binder (excluding a water-soluble macromolecule) of≥1 part weight and≤50 parts weight. The content of the granular body of the expanded organic resin exceeds 5 wt.% of this composition. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003327464(A) 申请公布日期 2003.11.19
申请号 JP20020138188 申请日期 2002.05.14
申请人 OHBAYASHI CORP;SK KAKEN CO LTD 发明人 HORI OSAO;TAKAHASHI KOICHIRO;KARUGA HIDETO
分类号 C04B28/02;C04B16/08;C04B24/24;C04B111/40;(IPC1-7):C04B28/02 主分类号 C04B28/02
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