Foldable retention device for pressing a heat sink to an electronic package mounted on a socket connector

摘要

A retention device (6) for securely retaining a heat sink module (5) and a package (4) upon a socket (3) includes a main frame (60), a spring clip (63) and an actuating lever (64). The main frame is mounted on a printed circuit board (2) surrounding the socket and package. The spring clip is pivotably assembled to the main frame, and includes a receiving arm (631) at a front end thereof. The actuating lever is assembled to the main frame and rotated to press against the receiving arm and securely retaining the heat sink module and package upon the socket.