| 摘要 |
An integrated circuit chip cooling structure is constructed to include a top plate member and a bottom plate member bonded together and defining a vapor chamber between said top and bottom plate member, the top and bottom plate members each having a plurality of through holes connecting members supported between the top and bottom plate members, each connecting member having a center through hole, a heat sink bonded to the top surface of the top plate member, the heat sink having a plurality of mounting holes for connection to the through hole of each connecting member and respective mounting holes of an external circuit board by respective screw bolts, and an internally sintered metal capillary wick provided within the vapor chamber.
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