发明名称 |
Cavity-down ball grid array package with semiconductor chip solder ball |
摘要 |
A cavity-down ball grid array package includes a substrate having a through cavity provided therein. A heat sink is attached to the substrate and a semiconductor chip in the cavity is attached to the heat sink and electrically connected to the substrate. A ball grid array is on the substrate and on the semiconductor chip.
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申请公布号 |
US6650015(B2) |
申请公布日期 |
2003.11.18 |
申请号 |
US20020173213 |
申请日期 |
2002.06.14 |
申请人 |
SILICONWARE PRECISION INDUSTRIES CO., LTD. |
发明人 |
CHEN EING-CHIEH;TZUNG SHIU-TAI;CHAI TING-KE;LAI JENG-YUAN;TIEN CANDY |
分类号 |
H01L23/13;H01L23/31;H01L23/36;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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