| 摘要 |
<p>A pulsed laser apparatus for providing controlled ablation of organic material in an object at a selected ablation point of interaction by means of generated laser pulses. The apparatus includes a laser for emitting a beam of pulses having a duration in the range of about 0.01 picoseconds to about 2 picoseconds. The apparatus comprises applanting device in contact with the object providing a positional frame of reference for the laser beam thereby determining an ablation point of interaction within the object.</p> |
