METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER AMD WAFER

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor wafer which can manufacture a wafer free from a ring type drop in an outer peripheral part of a wafer, when a wafer subjected to alkali etching is polished, and to provide the wafer free from the ring type drop in the outer peripheral part of the wafer.

SOLUTION: The manufacturing method is provided with: a partly polishing and chamber mirror finishing process of rear part wherein mirror finishing is performed as far as a part of in-plane surface of rear surface to the boundary with the chamber part of the material wafer; and a front surface polishing process wherein a rear of the wafer where partly polishing and chamber mirror finishing are performed is supported, and the front surface of the wafer is subjected to mirror finishing.

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