METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device having excellent cost performance by a simple method by using an optimal adhesive sheet as an adhesive agent for die-bonding. SOLUTION: The method for manufacturing the semiconductor device comprises steps of: dicing a semiconductor wafer in which a protection tape is stuck to a circuit surface to form an aggregate of chips; adhering and laminating adhesive films for die-bonding each having the approximately same size as each chip of the aggregate on the back side of each chip; picking up the chips by the adhesive film from the protection tape; and die-bonding the chips on a chip carrying substrate by the adhesive film. COPYRIGHT: (C)2004,JPO