SEMICONDUCTOR WAFER MANUFACTURING METHOD AND WAFER

摘要

A method for manufacturing a semiconductor wafer with no ring-like rounding produced during polishing of an alkali-etched wafer along the outer periphery of the wafer and a wafer with no ring-like rounding along the outer periphery thereof are disclosed. The method comprises a back grinding/edge polishing step of grinding the back of a wafer and polishing the edge thereof in such a way that a part of the wafer inside the chamfered portion boundary of the back of the material wafer may be polished, and a surface-polishing step of polishing the surface of the back-ground, edge-polished wafer while supporting the back of the wafer.