CHIP ON BOARD LEAD PACKAGE FOR OPTICAL MOUSE AND LENS COVER USED FOR THE SAME

摘要

PURPOSE: A chip on board lead package for an optical mouse and a lens cover used for the same are provided to be capable of simplifying manufacturing processes, reducing fabrication cost, and versatilely corresponding to the change of a product. CONSTITUTION: A chip on board lead package for an optical mouse is provided with a board(7) having a pair of through holes at the edge portion, a semiconductor chip(5) attached on the center portion of the upper surface of the board, and a circuit pattern(3) selectively formed on the upper surface of the board. At this time, the semiconductor chip includes a plurality of electrode terminals. The chip on board lead package further includes a bonding wire for electrically connecting the electrode terminal of the semiconductor chip with the circuit pattern and a lens cover(1) for covering the upper portion of the resultant structure. At this time, the lens cover includes a pair of pins(2) corresponding to each through hole. Preferably, the pin and the lens cover are formed as one piece by carrying out an injection molding process.