| 摘要 |
<p>A composition for forming an acrylic-based thermally conductive composition, containing a thermal polymerizing binder component comprising (i) at least one (meth)acrylic monomer or its partially polymerized polymer and (ii) a thermal polymerization initiator, and a thermally conductive filler, the composition including the thermally conductive filler in an amount of 30-90 vol% of said acrylic-based thermally conductive composition. The invention also provides a process for producing an acrylic-based thermally conductive composition comprising adding a thermally conductive filler to a thermal polymerizing binder component comprising at least one (meth)acrylic monomer or its partially polymerized polymer and a thermal polymerization initiator to form a thermal polymerizing mixture, and heating said thermal polymerizing mixture for polymerization to form an acrylic-based thermally conductive composition, wherein said thermally conductive filler is added in an amount of 30-90 vol% in said acrylic-based thermally conductive composition.</p> |
