发明名称 BLISTER PACKAGE
摘要 <p>Blister package are provided which are formed from multilayered films having a lid-stock film which is heat sealed directly to a fluoropolymer film. A polymeric base layer is adhered to a fluoropolymer layer via a first intermediate adhesive tie layer; a support layer is adhered to the fluoropolymer layer via a second intermediate adhesive tie layer; and a metallic foil layer is adhered to the support layer via a third intermediate adhesive tie layer. The blister has a greatly improved moisture barrier over blister packages of the prior art.</p>
申请公布号 WO03091019(A1) 申请公布日期 2003.11.06
申请号 WO2003US12620 申请日期 2003.04.24
申请人 HONEYWELL INTERNATIONAL INC. 发明人 BLUM, JOHN, B.;LUCIANO, SANDRA, E.
分类号 B65D75/34;B32B15/082;B32B27/08;B65D65/40;B65D75/36;(IPC1-7):B32B27/08;B32B3/28;B29D7/01 主分类号 B65D75/34
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