| 摘要 |
The present invention to a method for forming an exposed portion of a circuit pattern in a printed circuit board, wherein a solder resist is coated on a substrate having a circuit pattern, is hardened, and thereafter is processed by a laser in order to form a portion exposing the circuit pattern such as the solder land. When the solder resist is processed by the laser, the number of errors can be greatly reduced as compared to a processing error occurred in exposure or developing process, whereby a circuit pattern that is integrated higher than the solder land is formed for thereby miniaturizing the printed circuit board.
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