ELECTRON PACKAGE USING ULTRASONIC SOLDERING AND PACKAGING METHOD THEREFOR

摘要

PURPOSE: An electron package using ultrasonic soldering and a packaging method therefor are provided to efficiently connect a chip with a circuit of a substrate by generating local heat while using pressure and ultrasonic waves, and to improve productivity and quality in a soldering process by forming an underfill while the soldering process is performed. CONSTITUTION: Grooves(42) are formed on a surface of the substrate(40) confronting the chip(30). A plurality of protrusions(32) corresponding to the grooves are formed on a surface of the chip so that the protrusions are respectively inserted into the groove of the substrate. Solders(46) surrounding the protrusions are positioned inside the grooves.