发明名称 |
DUAL-SIDED HEAT REMOVAL SYSTEM |
摘要 |
The present invention describes a method and apparatus for mounting a microelectronic device parallel to a substrate with an interposer and two heat sinks, one on each side of the substrate. |
申请公布号 |
WO03090278(A2) |
申请公布日期 |
2003.10.30 |
申请号 |
WO2003US09681 |
申请日期 |
2003.03.27 |
申请人 |
INTEL CORPORATION |
发明人 |
VANDENTOP, GILROY;CHIU, CHIA-PIN;NAIR, RAJENDRAN;LI, YIAN-LIANG |
分类号 |
H05K1/02;H05K1/18 |
主分类号 |
H05K1/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|