发明名称 |
Heat sink for semiconductor die employing phase change cooling |
摘要 |
An electrical assembly, including an electrical device; and at least one self-contained phase change package in thermal contact with the electrical device, the self-contained phase change package including an enclosure and a phase change material arranged within the enclosure; wherein the phase change material is suitably selected to change phase during an overload condition.
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申请公布号 |
US2003202306(A1) |
申请公布日期 |
2003.10.30 |
申请号 |
US20030374118 |
申请日期 |
2003.02.25 |
申请人 |
INTERNATIONAL RECTIFIER CORPORATION |
发明人 |
DUBHASHI AJIT |
分类号 |
H01L23/427;H05K1/02;H05K1/18;(IPC1-7):H02H5/04 |
主分类号 |
H01L23/427 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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