| 摘要 |
PURPOSE: An acceleration sensor and a method for fabricating an acceleration sensor using MEMS(Micro Electro Mechanical System) technology are provided, which produce a compact sensor with low cost. CONSTITUTION: According to the method, the first oxide(11) is formed on both sides of a silicon wafer(10). The first oxide is patterned. A bottom side of the patterned silicon wafer is etched by a bulk etching. The second oxide(12) is formed on the bulk-etched silicon wafer, and then is patterned. A base silicon wafer(10') is stacked on the bottom side of the silicon wafer. A vibration sensor is formed on the silicon wafer by a DEEP RIE(Reactive Ion Etching) etching. An optical fiber insertion groove(26) is formed on the silicon wafer by a DEEP RIE etching. Then, an input/output optical fiber(40,42) are fixed to the optical fiber insertion groove. And a fixed structure(50) is packaged on a top side of the silicon wafer where the input/output optical fiber are fixed. |
