| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board which enables a design for a circuit of higher density to be realized. SOLUTION: In the multilayer wiring board 20, a first wiring pattern 3a and a second wiring pattern 3c are formed on the surfaces of a first insulating layer 1 and a second insulating layer 2, respectively, the first insulating layer 1 and the second insulating layer 2 are arranged as the first wiring pattern 3a and the second wiring pattern 3c confront each other through a gap, bumps 4 are provided between the first wiring pattern 3a and the second wiring pattern 3c so as to electrically connect them together, and an adhesive layer 5 is provided between the insulating layers 1 and 2. COPYRIGHT: (C)2004,JPO |
