| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor module which can be repaired whatever bare chip becomes defective, or whatever combination of bare chips become defective. <P>SOLUTION: On the rear face of a semiconductor module substrate 2, repair chips 3a, having long leads 10a and repair chips 3b having normal leads 10b, can be overlapped and mounted, and plural electric wirings of structure where a corresponding repair chip 3a or repair chip 3b to each of a plurality of the bare chips can be provided are formed. <P>COPYRIGHT: (C)2004,JPO |
