| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which reduces the size of an electronic part by integrating an inductance therein, and simplifies manufacture thereof. SOLUTION: The device is provided with an integrated circuit 2 which is formed on the upper surface of a semiconductor wafer chip W1, and the inductance 4 having at least two or more stacked layers, which is formed in a recess 3 formed in the wafer chip W1. The inductance 4 is connected to the integrated circuit 2 to constitute a resonant circuit. Each of the stacked layers of the inductance 4 in the recess 3 is formed into a flat coil. Such flat coils 7, 8 wound in opposite directions to each other are alternately stacked, in which the upper and the lower flat coils are connected to each other at the center side ends or at the peripheral side ends. COPYRIGHT: (C)2004,JPO
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