| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin molding material slightly causing chip shifts, voids and wire sweeps in a thin surface mounting type package and having excellent reflow resistance and an electronic part device having an element sealed with the epoxy resin molding material. SOLUTION: The epoxy resin molding material consists essentially of (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator and (D) an inorganic filler. The curing agent (B) contains a phenol resin represented by general formula (I) (wherein, R denotes a hydrogen atom, a substituted or an unsubstituted 1-6C alkyl group; m denotes 0 or an integer of 1-2; and n denotes 0 or an integer of 1-10). The amount of the component of the phenol resin in which n is≥1 is≤11 wt.%. The content of a polyfunctional phenol resin containing≥3 phenolic hydroxy groups on the average in one molecule is <10 wt.% in the total amount of the curing agent (B). COPYRIGHT: (C)2004,JPO
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