| 摘要 |
A surface acoustic wave device which can be made thin (low profile) and in which a surface acoustic wave element can be protected against thermal breakdown by shortening the heating process. The surface acoustic wave device comprises a substrate, a surface acoustic wave element having a comb type electrode formed on a piezoelectric substrate and flip-chip mounted on the substrate through bumps such that the comb type electrode faces the substrate, a first resin layer covering the surface acoustic wave element, and a second resin layer formed on the first resin layer, wherein the first resin layer and the second resin layer are composed of thermosetting resin making a state transition of setting after softening in the heating process, and first resin layer is formed of a resin material exhibiting higher fluidity through softening as compared with the second resin layer. |
